Solder paste Printer

Solder Paste Printer MAX 650L

DESEN MAX650L is a fully automatic visual solder paste printer engineered for high-precision SMT production and large-format PCBs. Supporting substrates up to 650 × 610 mm and PCB thicknesses from 0.6–6 mm, it combines high-precision alignment, intelligent PCB transport, programmable squeegee pressure, automatic platform detection, inspection functions, and automated cleaning to deliver stable and consistent solder paste printing.

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Intelligent Flexible High-Speed Transfer System

Automatic width adjustment and two-way clamping support PCB thicknesses from 0.6–6 mm. Multi-directional transfer, one-click size adjustment, and variable speed control provide a fast, flexible, and user-friendly operation. High-precision positioning and a robust PCB stop mechanism ensure smooth, stable, and reliable performance.

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High-Precision & Stable Platform

Backed by 20 years of industry expertise, our high-precision UVW drive module works with an advanced alignment algorithm to automatically adjust platform height according to PCB thickness. This ensures exceptional printing consistency and precision. Combined with an intelligent automatic platform inspection system, it provides stable, reliable positioning performance that meets the stringent accuracy requirements of advanced microelectronics packaging.

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Intelligent Monitoring

Equipped with a 13 MP HD dual-camera system and 10 × 8 mm field of view, the system delivers ultra-fast, millisecond-level coordinate acquisition with outstanding accuracy.

Its advanced automatic inspection technology identifies PCB printing defects with precision, while Mark point measurement, secondary positioning, and component recognition further enhance alignment and inspection performance. MES compatibility enables seamless production data integration and intelligent process management.

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High-Quality Squeegee

Equipped with a software-controlled closed-loop pressure feedback system, the squeegee pressure is infinitely adjustable from 0-20 kg, with real-time pressure feedback accuracy of +0.2 kg.

This ensures uniform and stable printing pressure throughout the entire process, providing a solid foundation for consistent and high-quality solder paste printing.

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Comprehensive Automatic Cleaning

Enhance production efficiency while ensuring operator safety. The system supports multiple cleaning modes, including wet, dry, and vacuum cleaning, providing flexible and consistent cleaning performance. By reducing manual intervention and production costs, it helps maintain high-quality results and reliable process stability.

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Convenient Operation & New User Experience

Powered by a proprietary intelligent control system, the machine features an ultra-simple interface and enables rapid programming and line changeover in just 5 minutes.

Its advanced core algorithms provide precise alignment and quality inspection alerts, while remote monitoring and production data traceability ensure complete process visibility.

advance Features

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Automatic Solder Paste Replenishment

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Automatic Z-Axis PCB Clamping

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Stencil Aperture Inspection

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Solder Paste Volume Inspection

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Glue Dispensing Function

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Ionizing Air at PCB Entry

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Temperature & Humidity Control

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Entry-End Barcode Scanning

 

MAX650L – Technical Specifications
Printing Performance
Printing Accuracy ±25 μm @ 6σ, Cpk ≥ 2.0
Repeat Position Accuracy ±10 μm @ 6σ, Cpk ≥ 2.0
Cycle Time 10 seconds
Screen Frame Size 550 × 550 mm – 900 × 900 mm
Screen Frame Thickness 20–40 mm
Minimum Substrate Size 100 × 80 mm
Maximum Substrate Size 650 × 610 mm
Optional: up to 750 × 610 mm
Substrate Thickness 0.6–6 mm
Print Pressure 0–20 kg
Print Speed 1–120 mm/sec
Print Gap 0–20 mm
Paste Separation Speed 0.1–20 mm/sec
Stencil Separation Distance 0–20 mm
Applicable Paste Options Solder Paste, Solder Ink, Silver Paste
Intelligent PCB Transfer System
Track Width Adjustment Program-controlled automatic track width adjustment
Transport Direction L→R, L→L, R→L, R→R
Maximum Substrate Weight <5 kg
Board Height ≤25 mm
Transport Height 900 ± 40 mm
Standard Configuration
Automatic Stencil Positioning Module Automatic stencil positioning within the screen frame
PCB Support Positioning System Support blocks, support pins, flexible support positioning,
and vacuum support capability
PCB Support Fixture Flexible side clamping and retractable support positioning
Squeegee Directly connected screw / double-pivot suspended squeegee
Automatic Platform Detection System Automatically calibrates platform height according to PCB thickness
Intelligent Transport System Automatic stop device and automatic PCB positioning;
supports L→R, L→L, R→L and R→R transport directions
Intelligent Closed-Loop Compensation Platform UVW platform with independently adjustable drive shafts
Constant Squeegee Pressure Control Software-controlled squeegee pressure adjustment
Cleaning Structure Wet cleaning + dry cleaning + vacuum cleaning
Dimensions & Weight
Equipment Dimensions 1425 (L) × 1584 (W) × 1545 (H) mm
Approximate Weight 1350 kg excluding optional configurations
Approximately 1500 kg depending on selected options
Electrical & Environmental Requirements
Voltage AC 220V ±10%, Single Phase, 50 Hz
Power 2 kW
Air Supply 4.5–6 kg/cm²
Operating Temperature −20°C to +45°C
Relative Humidity 30–70%

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