3D SPI Inspection Machine for PCB

Overview

3D Solder Paste Inspection (SPI) Machine uses Programmable Structured Light Modulation Phase Modulation Profilometry (PMP) to perform precise three-dimensional solder paste measurement while maintaining high inspection speed. It supports multiple inspection resolutions to accommodate different PCB and production requirements.

Phase Modulation Profilometry Technology (PMP)

Achieve three-dimensional measurement of solder paste for precision printing. It may greatly improve measurement accuracy while ensuring high-speed inspection.

RGB Tune Active Three-color 2D Lighting Source

Patented RGB function combines with independent shootings of red, green, and blue images, and a distinctive color filtering algorithm. It solves problems such as bridging misjudgment and uncertainty of relative basis surface, and ensures the supply of 2D/3D inspection results and color solder paste images. The RGB debugging versatility for PCBs of different colors enhances equipment repeatability accuracy (height, volume, and area).

Data Integration Function of SPI Pre & Post AOI
Our SPI may integrate data from different inspection equipment on SMT production lines, such as Pre-reflow AOI, and Post-reflow AOI, to build a whole closed-loop quality control system and synchronize data in quality control systems like ERP.

MES Intelligent Manufacturing Access Capability

We developed a variety of data format ports and utilized the SPI system to upload data into the client MES system in a simple, fast, and accurate way.

GERBER module importing and Friendly Programming UI

Engineers of any level can program independently, quickly, and accurately. The one-click operation designed for operators also greatly reduces training stress.

Powerful SPC
Real-time SPC information display provides strong quality control support for operators. Moreover, complete and diverse SPC tools enable them to be clear and support data output of different formats.

Key features

• 3D PMP Measurement Technology – Uses Programmable Structured Light Modulation Phase Modulation Profilometry for high-speed, high-precision solder paste inspection.
• 3D Solder Paste Measurement – Measures solder paste volume, area, height, XY offset, and shape.
• RGB Tune Technology – Active RGB three-color imaging and color filtering technology provides reliable 2D and 3D inspection results for different PCB colors.
• Multiple Inspection Resolutions – Supports inspection resolutions from 2.8 μm to 20 μm to meet different product and inspection-speed requirements.
• High-Resolution Image Processing – Telecentric lenses and dedicated inspection algorithms improve imaging accuracy and reduce distortion-related inspection errors.
• FPC Warpage Compensation – Combines Z-axis dynamic compensation with telecentric-lens static compensation for improved inspection of warped FPCs.
• High-Precision Motion Platform – Integrated steel construction with servo motor, precision ball screw, and guide rails provides fast and stable movement.
• Optional Linear Motor System – Linear motor and high-accuracy grating ruler options support high-speed inspection of small components such as 03015.
• Automatic Mark Point Recognition – Automatically identifies PCB reference marks for inspection positioning.
• Bad Board Mark Recognition – Supports automatic identification of bad-board marks during production.
• Closed-Loop Process Control – Inspection data can be shared with printers and pick-and-place machines for real-time process adjustment.
• SPI, Pre-Reflow AOI & Post-Reflow AOI Integration – Supports data integration between inspection stages to establish a closed-loop quality-control system.
• MES Integration – Supports multiple data-format interfaces for transferring SPI inspection data to MES systems.
• Fast Programming – GERBER import and a user-friendly programming interface enable fast inspection-program creation.
• One-Click Operation – Simplifies operation and helps reduce operator training requirements.
• Powerful SPC Analysis – Provides real-time SPC information, quality-control tools, and multiple data-output formats.
• Flexible PCB Handling – Supports left-to-right or right-to-left PCB transfer and manual or automatic track-width adjustment.

Technology

• It provides a variety of detection accuracy, such as 2.8 µm, 4.5 µm, 5 µm, 7 µm, 8 µm, 10 µm, 12 µm, 15 µm, 18 µm, 20 µm, etc., and meets the customer s requirements for product diversity and detection speed.
• Adopt the high-cost telecentric lens and special software test algorithm to solve problems of ordinary lenses, such as squinting and deformation. It enhances inspection accuracy and ability and achieves the industry's leading Static + Dynamic Compensation for FPC warping.
• High-strength integrated steel structure combines with a standard Servo Motor, high-precision grinding grade ball screw, and guide to keep mobility fast and steady. Optional linear motor and high-accuracy grating ruler may fast and accurately measure solder paste on 03015 component with a repeatability accuracy of 1 µm.
• Our SPI may automatically identify mark points and bad marks, share real-time inspection data with printers and mounters, and adjust printing and mounting processes in real time.

Technical specifications

Options

• Maximum measuring height

  (±1200μm as option)

• Minimum component

  01005/03015/008004

• Fixed and mobile track setup

  Front fixed track (back fixed track as optional)

• Software

  Multi-centralized control software

• Network

  SPC software

• barcode scanner

  1D/2D

• Programming software

  Off-line

• Power

  UPS continuous power supply