Solder Paste Printer Series

Solder paste Printer

Wide area Coverage, Precise Control

Unleash Superior Efficiency and Precision

Fully Automatic Solder Paste Printer

Super large printing area: Max. 650x610mm, suitable for large-size substrates

Ultra-high positioning accuracy: Printing precision up to +25um, guaranteeing excellent printing and Quality

Intelligent Flexible High-Speed Transfer System

Automatic width adjustment and two-way clamping support PCB thicknesses from 0.6–6 mm. Multi-directional transfer, one-click size adjustment, and variable speed control provide a fast, flexible, and user-friendly operation. High-precision positioning and a robust PCB stop mechanism ensure smooth, stable, and reliable performance.

High-Precision & Stable Platform

Backed by 20 years of industry expertise, our high-precision UVW drive module works with an advanced alignment algorithm to automatically adjust platform height according to PCB thickness. This ensures exceptional printing consistency and precision. Combined with an intelligent automatic platform inspection system, it provides stable, reliable positioning performance that meets the stringent accuracy requirements of advanced microelectronics packaging.

Intelligent Monitoring

Equipped with a 13 MP HD dual-camera system and 10 × 8 mm field of view, the system delivers ultra-fast, millisecond-level coordinate acquisition with outstanding accuracy.

Its advanced automatic inspection technology identifies PCB printing defects with precision, while Mark point measurement, secondary positioning, and component recognition further enhance alignment and inspection performance. MES compatibility enables seamless production data integration and intelligent process management.

High-Quality Squeegee

Equipped with a software-controlled closed-loop pressure feedback system, the squeegee pressure is infinitely adjustable from 0-20 kg, with real-time pressure feedback accuracy of +0.2 kg.

This ensures uniform and stable printing pressure throughout the entire process, providing a solid foundation for consistent and high-quality solder paste printing.

Comprehensive Automatic Cleaning

Enhance production efficiency while ensuring operator safety. The system supports multiple cleaning modes, including wet, dry, and vacuum cleaning, providing flexible and consistent cleaning performance. By reducing manual intervention and production costs, it helps maintain high-quality results and reliable process stability.

Convenient Operation & New User Experience

Powered by a proprietary intelligent control system, the machine features an ultra-simple interface and enables rapid programming and line changeover in just 5 minutes.

Its advanced core algorithms provide precise alignment and quality inspection alerts, while remote monitoring and production data traceability ensure complete process visibility.