FAROAD · Led Solder Paste Printer
Led Solder Paste Printer P20
Led Solder Paste Printer
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FAROAD · P Series
Solder Paste Printer P6
Model P6
Fully Automatic Visual Solder Paste Printer is designed for high-precision SMT production and large-format PCB applications. It supports substrates up to 650 × 610 mm with printing accuracy of ±25 μm @ 6σ, Cpk ≥ 2.0
Overview
Solder Paste Printer P6 is built for manufacturers requiring reliable solder paste printing across a wide range of PCB sizes. Its automated stencil positioning, intelligent transmission system, flexible PCB support, and software-controlled squeegee pressure help maintain consistent printing results throughout production. The machine also incorporates an intelligent closed-loop compensation platform and automatic cleaning structure, while supporting PCB thicknesses from 0.6–6 mm and print speeds of 1–120 mm/sec
Key features
- Large-Format PCB Support – Handles substrates up to 650 × 610 mm, with expansion up to 750 × 610 mm.
- High-Precision Printing – Achieves printing accuracy of ±25 μm @ 6σ, Cpk ≥ 2.0.
- High Repeat Position Accuracy – Provides repeat positioning accuracy of ±10 μm @ 6σ, Cpk ≥ 2.0.
- Automatic Stencil Positioning – Automatically positions the stencil after it is placed into the support frame.
- Intelligent Board Transport – Provides automatic track-width adjustment and supports multiple PCB transport directions.
- Flexible PCB Support System – Uses support blocks, support pins and a flexible vacuum cavity for PCB positioning.
- Automatic Platform Detection – Automatically adjusts platform height according to PCB thickness.
- Intelligent Closed-Loop Compensation – Uses a UVW platform with independent shaft-drive adjustment for precise compensation.
- Constant Squeegee Pressure Control – Allows squeegee pressure to be adjusted through software control.
- Flexible Squeegee System – Supports print pressure from 0–20 kg and printing speeds of 1–120 mm/sec.
Technical specifications
Process Parameters
| Printing Accuracy | ±25μm@6σ, Cpk≥2.0 |
|---|---|
| Repeat Position Accuracy | ±10μm@6σ, Cpk≥2.0 |
| Cycle Time | 10S |
| Screen Frame Size | 550mm × 550mm ~ 900mm × 900mm |
| Screen Frame Thickness | 20mm - 40mm |
| Substrate Size (minimum) | 100mm (X) × 80mm (Y) |
| Substrate Size (maximum) | 650mm (X) × 610mm (Y), expandable to 750 × 610mm |
| Substrate Thickness | 0.6mm - 6mm |
| Print Pressure | 0kg - 20kg |
| Print Speed | 1mm/sec - 120mm/sec |
| Print Gap | 0mm - 20mm |
| Substrate Separation | Speed: 0.1mm/sec - 20mm/sec Distance: 0mm - 20mm |
| Apply Paste Option | Solder paste, ink, silver paste |
Intelligent Transmission System
| Width Adjustment | Program automatic track width adjustment |
|---|---|
| Transport Direction | L→R, L→L, R→L, R→R |
| Substrate Weight | ≤5kg |
| Board Height | ≤25mm |
| Transport Height | 900±40mm |
Standard Configuration
| Automatic Positioning Module of Stencil | Put the stencil into the support frame, the squeegee automatically realizes the positioning of the stencil. |
|---|---|
| PCB Support Positioning System | Support block, support pin, free splicing type vacuum cavity |
| Substrate Fixture | Flexible side clamp, Z-direction retractable platen device |
| Squeegee | Directly connected screw / Double pivot suspended scraper |
| Automatic Platform Detection System | The platform height is automatically calibrated according to the thickness of the board |
| Intelligent Transport System | Automatic stop device + automatic substrate positioning + L→R, L→L, R→R, R→L |
| Intelligent Closed-Loop Compensation Platform | UVW platform, shaft drive independent adjustment |
| Constant Intelligent Control System of Squeegee Pressure | Pressure adjusted by software control |
| Cleaning Structure | Wet cleaning + dry cleaning + vacuum free combination |
| Approximate Dimensions | 1425 (L) × 1584 (W) × 1545 (H) mm |
| Approximate Weight | 1350kg unboxed (dependent upon configured options selected with machine) |
Electrical Configuration & Environmental Requirements
| Voltage | Single-phase AC220V±10%, frequency 50Hz |
|---|---|
| Power | 2kW |
| Air Supply | 4.5-6kgf/cm² |
| Temperature | -20°C ~ +45°C |
| Humidity | Relative humidity 30%-70% |
Options
Extended PCB Size Capability
Maximum substrate size can be expanded to 750 × 610 mm.
Glue Dispenser
Automatic Add Glue dispenser can be added where it is required to place the glue on the pcb board
2D Inspection
2D Inspection System can be added for the inspection of solder paste after application.
Related equipment
Request a quote for the P6
Share your board sizes, components and throughput targets and our team will recommend a configuration.